As electronic devices become increasingly smaller, lighter, thinner and more powerful, the demand for more precise and faster packaging technology has increased. Despite the difference in various packages available in the industry, the technology of packaging processes share common steps.
In general, these steps include: die preparation, die attach, wire bonding and encapsulation. Among these steps, die attach is one of the most challenging processes, as it involves material compatibility, placement and dispensing accuracy, precision process temperature profile and a short cycle time...
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